The 2010 PackExpo will be held in Chicago at McCormick Place on October 1 through November 3, 2010. The October issue of H&P offers a preview of the fluid power exhibits scheduled for the event.
Fluid power continues to find ways to make packaging machinery more efficient and effective. For more information check out www.packexpo.com.
Packaging machinery represents a key market for fluid power components with pneumatic technology taking the lead. Whether it is wrapping food or placing products neatly in their proper places, designers can count on fluid power to deliver .... and package.